“TACT WINS” Sanitation Practices in the Food Industry

The food industry is one of many that requires extremely rigorous sanitation practices every step of the way. Because the food industry distributes products worldwide, it’s critical for everyone participating in food production and packing to do their part in preventing the spread of foodborne illness and poor food quality. At Forpak, our part in supporting food safety and sanitation practices is our production of high-quality, innovative packaging systems. Our equipment meets multiple standards for food safety, including the NSF 3A Requirements for Meat & Poultry, the BISSC Standard for Baking, FDA and USDA standards, and our own strict policies for hygiene and food-grade sanitation.

The USDA’s Hazard Analysis and Critical Control Point (HACCP) rules are the primary guidelines and requirements that reduce the risk of pathogen travel and ensure the safety of meat, poultry, and egg supplies. In addition to the rules of the HACCP and the other standards and regulations we design our equipment to fully meet, we also adhere to the elements of TACT WINS, an acronym for industry sanitation principles.


Time is a critical component of food production hygiene and industrial efficiency. Too little time spent cleaning equipment can lead to unclean surfaces, while too much time will waste valuable resources. With full wash-down capabilities, Forpak’s equipment offers the fastest, most hygienic cleanup options.


Sanitation actions include worker effort and the chemical action of cleaning solutions. Action is especially important with Forpak’s clean-in-place equipment to prevent the spread of contaminants throughout a facility and complete a sanitation process that limits production downtime.


Cleaning solutions should be concentrated enough to sanitize, but not so concentrated that they waste product and pose a risk to equipment surfaces.


Sanitation temperatures need to be hot enough to kill contaminants and remove non-water-soluble particles without creating risks to worker safety and equipment.


Water is a universal cleaning system for cleaning solution concentrates, rinsing, and destroying most particles that are present on food packaging equipment. NEMA 4X Watershed Enclosures on Forpak equipment protects all electronics and controls from water cover, allowing the rest of the machine full exposure.


Equipment cleaning should be tracked with a record system. This helps keep a routine schedule and accountability for which employees performed the wash down.


Soil, bacteria, and other natural elements in food should be noted and controlled in ways specific to the type of food product and the equipment used.


All Forpak equipment is built with food-grade stainless steel to prevent the spread of contamination on surfaces and eliminate the risk of corrosion. Surfaces that come into contact with food products must be able to have regular, strict sanitation.

To learn more about standards and our packing equipment for the food industry, contact Forpak at (612) 419-1948 or forpaksupport@multisourcemfg.com. Request more information online today or request a quote to get started with us today.


Specialized Capabilities for the Fabrication of Semiconductor Components

MultiSource Manufacturing LLC has been fabricating semiconductor parts and full semiconductor assemblies for over 35 years. Our facilities have state-of-the-art equipment specialized for semiconductor component machining, and our engineers and technicians have the expertise to handle any industry-specific production requirements. When it comes to semiconductor manufacturing, we are an industry-leading provider of optimized parts and assemblies. With a Class 1 clean room, plastic fabrication and welding capabilities, and comprehensive tear down reverse engineering of various semiconductor components for OEMs and other customers, MultiSource has the skills and tools needed to get the job done.

MultiSource provides contract manufacturing services to a broad range of industries. Our collection of multi-axis machining centers, mills, lathes, and additional equipment with our staff experience and training makes our production floor one of the best for many projects, from prototype design to finishing touches.

For the semiconductor industry, our PFA fabrication and reverse engineering capabilities, as well as our state-of-the-art clean room, allow us to build parts and assemblies that require highly specialized fabrication techniques.

PFA Fabrication and Welding:

Fluoroplastics are utilized heavily in semiconductor part manufacturing. PFAs and other fluoroplastics have high working temperatures, non-stick properties, high resistance to chemicals, solvents, and electrical currents, and low friction surfaces. With PFA welding and other fabrication capabilities, we can create innovative solutions for housing circuit boards, microchips, and other semiconductor components.

Class 1000 Clean Room:

Semiconductor parts need to be fabricated in highly clean, contaminant-free environments. With our ISO Class 3 clean room, we work with a directed recirculating airflow that passes through heavily-filtered quarantining systems. Fabrication technicians wear full hazmat PPE and handle semiconductor materials with strict hygiene protocols. Our clean room and sanitary manufacturing practices ensure a quality product.

Reverse Engineering:

For years now, reverse engineering has been an accepted manufacturing practice in many industries. For the electronics and semiconductor industries, reverse engineering is recognized as an effective method of competitive intelligence. Our engineers have extensive education and experience for reverse engineering and improving designs of semiconductor components, from standardized industrial parts to unique formats of electronic gridding.

Our goal in all our semiconductor parts and assemblies is to optimize designs as we machine, fabricate, clean, test, package, and custom-crate each product. From microchip reticle handling and wet processing to plastic and steel manufacturing, we have virtually unlimited resources and capabilities for building parts and assemblies in the semiconductor industry.

To learn more about our fabrication of semiconductor components, contact MultiSource Manufacturing LLC at (952) 456-5500. Request more information, or request a quote to get started with us today.